YHJ2M77120 High precision vertical double-sided grinder
Category: Product Center
Keywords: Yuhuan
Typical Machined Parts
Processing Methods
Equipment Highlights
1. The lower disc adopts the structure of hydrostatic turntable bearing in the axial direction, which has the characteristics of high precision and high rigidity.
2. The inner and outer gear rings of the lower disc are driven by servo motor independently, the process can be adjusted in a wide range, and the process parameters can be adjusted flexibly according to different material products.
3. The upper plate adopts floating cylinder mechanism to adjust balance, and four groups of floating cylinders are arranged symmetrically and evenly, which can improve the machining efficiency on the premise of keeping the machining precision.
4. The upper and lower disks are equipped with independent cooling water channel cooling grinding disks. The upper and lower disks are equipped with multi-point temperature sensors (with wireless sensors) , ensure that the temperature of the grinding disc is uniform and constant.
5, configuration on-line detection system (optional) , to achieve simultaneous processing and detection, processing qualified rate is high.
Technical Parameter
|
Project |
Parameter |
|
Single wafer substrate thickness difference TTV |
≤1.5 |
|
Thickness difference between wafer substrate and substrate（μm） |
≤3 |
|
minimum thickness of wafer substrate （μm） |
350 |
|
wafer substrate flatness（μm） |
≤1.5 |
|
wafer substrate after chemical polishing roughness(nanometer） |
≤Ra8 |
|
disc flatness （mm） |
≤0.005 |
|
disc maximum loading pressure（t） |
2 |
|
disc maximum stroke（mm） |
500 |
|
disc size（mm） |
Φ1120*Φ385*50 |
|
disc bounce（mm） |
≤0.01 |
|
disc size（mm） |
Φ1120*Φ385*50 |
|
disc lift height （mm） |
24~28 |
|
Project |
Parameter |
|
Maximum load bearing(t) |
7 |
|
upper disk speed （RPM） |
5~80 |
|
lower disk speed（RPM） |
5~80 |
|
upper disk motor power（KW） |
18.5 |
|
lower disk motor power（KW） |
18.5 |
|
sun wheel speed（RPM） |
5~100 |
|
sun wheel motor power（KW） |
4.4 |
|
outer ring gear speed（RPM） |
1~10 |
|
outer ring motor power（KW） |
4.4 |
|
Number of rotors (units) |
5 |
|
wafer processing specifications (inches) |
≤8”（For proofing）6”（Commonly used） |
|
weight of equipment （t） |
7.5 |