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YHM7430 High precision vertical single-side grinder


This machine is automatic, high efficiency machine tool, suitable for batch processing parts, mainly used for one-sided grinding parts of the plane, cBN wheel and diamond wheel are used to thin sapphire, glass, ceramics, semiconductors and other metal and non-metal hard brittle materials Can be widely used in LED sapphire substrate, semiconductor products such as single-side grinding thin processing

Category: Product Center
Keywords: Yuhuan

Processing Methods

Equipment Highlights

1. The machine adopts IN-FEED grinding theory, the servo motor drives the grinding wheel to move in the vertical direction, the lower disc is driven by the servo and synchronous belt, it can rotate with the grinding wheel in the same direction or in the opposite direction according to the process requirement.

2. The machine adopts precision cross roller bearing + deep groove ball bearing to support the spindle of workpiece, which is rigid and high precision, and adopts vacuum adsorption to clamp the tooling or workpiece.

3. The grinding head adopts the electric spindle to drive the grinding wheel to rotate, adopts the classical way of screw rod + line rail + servo motor to drive the vertical feed, and uses the high-precision grating closed-loop feedback to control the Z-axis feed precision.

4. Using double-probe measuring instrument mabis D-Model + 2Unimar, the error of grinding thickness can be controlled accurately. 5, the use of interactive man-machine interface (touch screen) , accurate control, easy to use.

Technical Parameter

Project

Parameter

Diameter of grinding wheel

Φ380mm

Workpiece

Maximum outside diameter

Φ300mm

motorized spindle spindle

speed

100-2500r/min

power

11kW

 z-axis

stroke

125mm

power

0.4kW

minimum feed unit

0.001mm

 fast-moving speed

400mm/min

maximum feed

5mm/s

minimum resolution

0.1μm

worktable

feed travel

400mm

fast-moving speed

10m/min

speed

5-350r/min

On-line measurement of repeated positioning accuracy

±0.5μm

On-line thickness measurement resolution

0.1μm

Machining accuracy

TTV Monolithic

3μm

TTV Between slices

±3μm

Weight of the whole machine

3500kg