13B-9L/8432C/8432E/8436B/18B/22B High Precision Vertical Double Sided Grinding (Polishing) Machine Series
Category: Product Center
Keywords: Yuhuan
Typical Machined Parts
Silicon Wafer
Sapphire
Mobile Phone Glass
Equipment Highlights
● This series of machine tools belong to 4 planetary annular polishing motions.
● It adopts the lifting method of the inner gear cam mechanism and is equipped with a safety self-locking cylinder device.
● The sun gear, the lower plate, the upper plate and the ring gear are driven by the gear pair + reducer transmission mode, and the speed is adjusted by frequency conversion.
● Adopt air cylinder + electric proportional valve to control loading pressure, adopt touch screen + PLC control mode.
Technical Parameter
|
Project |
Unit |
YH2M13B-9L |
YH2M8432C |
YH2M8432E |
YH2M8436B |
YH2M18B |
YH2M22B |
|
Grinding disc size (outer diameter x inner diameter x thickness) |
mm |
φ978x φ558x45 |
φ1070x φ495x45 |
φ1070x φ495x45 |
φ1140x φ375x45 |
φ1280x φ449x50 |
φ1462x φ494x50 |
|
Planetary Gear Specifications |
DP=12 Z=108 |
P=15.875 Z=64 |
P=16.842 Z=60 |
P=15.875 Z=84 |
P=21.053 Z=71 |
M=3 Z=184 |
|
|
Place the number of planetary gears |
n |
3≤n≤9 |
3≤n≤7 |
3≤n≤7 |
3≤n≤5 |
3≤n≤5 |
3≤n≤5 |
|
Maximum size of workpiece |
mm |
φ180 (diagonal) |
φ280 (diagonal) |
φ280 (diagonal) |
φ360 (diagonal) |
φ420 (diagonal) |
φ480 (diagonal) |
|
Minimum thickness of workpiece |
mm |
0.4 |
0.6 |
0.3 |
|||
|
Abrasive flatness |
mm |
0.006(φ100) |
|||||
|
Polished flatness |
mm |
0.008(φ100) |
|||||
|
Abrasive surface roughness |
μm |
Ra0.15 |
0.04 |
||||
|
Surface roughness of polished parts |
μm |
Ra0.05 |
|||||
|
Dimensions (Approx: LxWxH) |
mm |
1650x1300 x2650 |
1510x1450 x2650 |
1800x1500 x2650 |
2200x1750 x2690 |
3800x3300 x3600 |
|
| Overall weight (approx.) |
kg |
2600 |
3500 |
3200 |
3000 |
5000 |
11000 |
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