YH2M8155 Four-axis Precision Single-sided Grinding (polishing) Machine
Category: Product Center
Keywords: Yuhuan
Typical Machined Parts
Silicon Wafer
Sapphire
Equipment Highlights
● This machine adopts eccentric planetary motion.
● The workpiece plate and polishing plate are directly driven by the reducer, and the speed is adjusted by the frequency converter.
● Adopt air cylinder + electric proportional valve to precisely control the pressure, adopt touch screen + PLC control mode.
Technical Parameter
|
Project |
Unit |
Parameter |
| Precision bottom plate size |
mm |
φ1422 x 145 |
|
Platen size and material |
mm |
φ550/SUS304 flatness≤5um |
|
equipment weight |
T |
9 |
|
Device size (L*W*H) |
mm |
2255 x 1875 x 3300 |
|
Panel temperature detection system |
- | have |
|
Polishing liquid supply system |
- | have |
|
PP head cooling system |
- | Optional |
|
Bottom plate cooling system |
- | have |
|
Upper platen motor forced rotation (upper drive) 4 sets |
- | have |
|
Turning tool servo system |
- | Optional |
|
Full process control system |
- | Possess/can write 10-step process (50recipe) |
|
Historical data storage and reading system (temperature, speed, time, pressure) |
- | have |
|
Water Guns and Air Guns |
- | have |
|
Upper platen pressure and accuracy |
- | The maximum pressure of a single platen is 500kg/ea, the minimum pressure is 40kg/ea, and the pressure fluctuation and error are within 3% |
|
Applicable power supply |
- | Power supply voltage: 380V±10%/220V±10%, power supply frequency: 50Hz±2% |
|
equipment power |
kW |
≦30 |
|
Air pressure requirement |
Mpa |
End pressure: 0.5～0.7 |
|
cooling water requirement |
- | Pressure: 2-4kg/cm2, flow: 10-16L/min. Temperature: 8-18℃ |
|
environmental needs |
- | Ambient temperature: 0℃-45℃ |
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