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YH2M8432F Vertical double-sided polishing machine


This machine is mainly used for double-sided grinding and polishing of List of semiconductor materials parts such as silicon, germanium and quartz crystals, as well as thin sheet parts made of non-metallic hard and brittle materials such as optical glass and ceramics.

Category: Product Center
Keywords: Yuhuan

Typical Machined Parts

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Silicon wafer

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quartz glass

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optical glass

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ceramics

Equipment Highlights

1, the machine pallet, lower disc, hollow shaft through high-stiffness, high-precision bearing and fixed sleeve bearing, can ensure very high pallet jump;.

2.form of gear ring lifting: new research and development of the outer gear ring lifting mechanism, lifting precision is higher, good consistency, lifting without blocking phenomenon, the travel wheel movement precision is higher, the replacement of polishing pad is more convenient.

3.planetary gear meshing form: new design pin meshing, when the inner ring gear or the sun gear tooth wear, can quickly remove the single pin replacement, no need to replace the entire inner ring gear or the sun wheel, low cost, easier to maintain.

4. In order to realize the automatic feeding and unloading function of the follow-up industrial robot, the sun wheel parts and the lower disk driving parts of this machine are controlled by servo motors, coordinate with the cylinder in the outer gear ring positioning device to move up and down accurately to position the outer gear ring taper positioning pin, as well as the secondary accurate positioning after rotation, finally, with the industrial robot to take the cruise ship and workpiece when loading and unloading trouble-free operation.  

5.the machine's liquid supply device 1 adopts the independent liquid supply pump and the agitation pump, ensures that the grinding liquid is fully suspended and does not precipitate, the liquid supply pipeline fittings are all made of stainless steel, the pipeline chooses the steel wire hose, and is not easy to bend, the flow tank is designed with a head-type structure, with up to 40 outlet pipes connected to the outlet hole of the upper disc to ensure even and large flow of grinding fluid, the users can choose the connecting cooling water (diameter of pipe nozzle: Φ12) according to their needs. The temperature of connecting cooling water is ≤15 ° C and the pressure is 2 kg/CM2.

Technical Parameter

Project

Parameter

Polishing disc size

Φ1070xΦ495x45mm

upper lapping disc speed

2-25r/min

lower lapping disc speed

2-50r/min

sun wheel speed

2-22r/min

up-down stroke

450mm

ring gear lift stroke

30mm

maximum machining pressure

350Kg

end surface runout allowance

0.12mm

 ring gear radial runout allowance

0.25mm

Gear ring end run-out allowance

0.25mm

Sun Wheel radial run-out allowance

0.15mm

sun wheel end run-out allowance

0.15mm

power supply

Three-phase five-wire AC380V

total equipment power

15KW

host size (length × width × height) 

About 1800×1500×2900mm

machine weight

About 3500Kg

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